Water cooling system for computer components

ABSTRACT

The water cooling system for computer components is a system for removing heat from the heat-producing components of a computer, or other electronic, system. The water cooling system for computer components employs one or more water-block type heat exchangers to remove heat from electronic circuit components, transferring heat to a fluid coolant. A heat dissipating device, in the form of a tubing coil, dissipates heat from the coolant. A coolant pump circulates a fluid coolant from a coolant reservoir, through fluid conduits interconnecting the water-block heat exchangers and the heat dissipating device. The water-block type heat exchangers are formed from a single, solid block of material, and have an internal water passage directing the fluid coolant through the center of the block to apply maximum cooling to the center of an electronic circuit components where the maximum heat is produced.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cooling system for electronic components, and more particularly, to a water cooling system for computer components components.

2. Description of the Related Art

It is well known that electronic components generate heat during operation. Integrated circuit components tend to generate an increasing amount of heat as additional circuits or gates are included in ever-smaller packages. In computer systems, including well-known personal computer systems, generated heat must be removed from the electronic components to maintain the system within operating limits. Over-temperature operations can lead to decreased performance and to component damage.

In computer systems, including personal computers, fans are commonly used to circulate air over the electronic components for cooling. One or more fans typically draws air into the computer's housing, providing a general cooling air circulation throughout. While such a technique can be effective, such a generalized cooling may be insufficient for a circuit where one or a few individual components produce the greatest amount of heat. In a personal computer, the CPU (Central Processing Unit) chip is typically the greatest single heat producer, often with a display graphics driver such as a Video Graphics Array (VGA) chip a close second. With such single-point sources of heat, generalized airflow within the computer housing does not provide optimal cooling.

A solution to such single-point heat sources is the placement of a heat sink on the heat source, as by placing a heat sink directly on the CPU. A heat sink generally conducts heat away from the component to a large surface area, the large surface area often being a plurality of cooling fins through which increased air contact removes a greater amount of heat. Size considerations, as well as practical limitations on the amount of air that can be circulated within the housing, limit the effectiveness of air-cooled heat sinks.

Water cooling systems place a water-cooled block, generally of metal such as copper or aluminum, on a heat-generating component. Water is circulated through the block, and the water is cooled in a heat-dissipating device such as a radiator. A water channel passing through the water block is subject to manufacturing limitations, and thus may not be optimally routed to direct the cooling water to the center of the circuit component, where heat production is greatest. Water blocks may be manufactured from a solid block of metal, with holes drilled into the water block to form the water channels, with the end of the drilled holes plugged as needed to create water-tight water channels. In this case, placement of a water channel is limited by the reach of a drill press. Alternatively, a water block car be formed by milling the water channel into the top of a metal block, and then securing a cover over the block. While this method allows an arbitrary water channel path, the need to seal the cover presents an increased risk of leakage.

A typical radiator employs a metal tubing having a number of cooling fins disposed along the tubing. One or more fans pass air through the cooling fins, transferring heat away. Increasing the number, and thereby the density, of the cooling fins tends to require additional, or stronger, fans to force ail through the decreased spaces between fins, and thus increase the noise and vibration produced by the cooling system, as well as the power required to operate the cooling system. Additionally, suitable radiators tend to be relatively costly.

Thus a water cooling system for computer components solving the aforementioned problems is desired.

SUMMARY OF THE INVENTION

The water cooling system for computer components employs a heat-dissipating device along with one or more water blocks to cool electronic components of a computer system. The water cooling system for computer components employs, as a heat dissipating device, a length of copper tubing formed into a coil. The copper coil provides sufficient heat transfer for the cooling system with no fans employed. A single fan may be used to pass air over the coiled tubing for enhanced heat dissipation, the fan being oriented to move air along an axis passing lengthwise through the coil.

One or more solid metal water blocks are used to cool various components within the computer system. Each of the water blocks is formed from a solid metal block by drilling a plurality of holes through the block to form a water channel. The ends of the holes are plugged as necessary to create water-tight water channels. The holes are disposed in the block to from a water channel that passes through the center of the block, so that the block, when mounted on a circuit component, directs maximum cooling to the center of the circuit component.

These and other features of the present invention will become readily apparent upon further review of the following specification and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an environmental, perspective view of a water cooling system for computer components according to the present invention.

FIG. 2 is a perspective view of a heat dissipating device for the water cooling system for computer components according to the present invention.

FIG. 3 is an exploded view showing the mounting of a water block to an electronic circuit component in a water cooling system for computer components according to the present invention.

FIG. 4 is an exploded perspective view of a water block for cooling a CPU chip for the water cooling system for computer components according to the present invention.

FIG. 5 is a sectional view of the water block for cooling a CPU chip shown in FIG. 4, showing the water block's internal water channels.

FIG. 6 is a perspective view of a mounting bracket for the water block for cooling a CPU chip shown in FIG. 4.

FIG. 7 is an exploded perspective view of a water block for cooling a VGA chip for the water cooling system for computer components according to the present invention.

FIG. 8 is a sectional view of the water block for cooling a VGA chip shown in FIG. 7, showing the water block's internal water channels.

FIG. 9 is a perspective view of a mounting bracket for the water block for cooling a VGA chip shown in FIG. 7.

Similar reference characters denote corresponding features consistently throughout the attached drawings.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention is a water cooling system for computer components. Referring to FIG. 1, the water cooling system for computer components comprises at least one water-block heat exchanger 20, disposed on an electrical circuit component within a computer system, in connection by a network of coolant circulation lines or conduits 30 with a coolant reservoir 40 and a heat-dissipating device 10. A coolant pump 42 circulates a fluid coolant through the water-block heat exchangers 20, and through the heat-dissipating device 10. As the coolant passes through a water-block heat exchanger 20, heat from an electrical circuit component is transferred through the water-block heat exchanger to the coolant, thereby removing heat from the electrical circuit component. As the coolant passes through the heat-dissipating device 10, heat is transferred from the coolant and is dissipated into air surrounding the heat-dissipating device 10.

Turning now to FIG. 2, the heat-dissipating device 10 comprises primarily a coil 11 of tubing 13. The coil 11 is formed from a length of tubing 13 that is coiled about a central axis. Copper tubing is used for the coil 12 of the illustrated embodiment, although any type of tubing having a sufficient heat-transferring characteristic may be used. Support posts 17 hold the coil 11 in position. In the illustrated embodiment, four support posts 17 are used, each post extending vertically from a corner of the square housing of a fan 19. The fan 19 may be provided to increase airflow across the coil 11, generally along the axis of the coil 11. While the heat-dissipating device 10 provides sufficient heat dissipation without the fan 19 for some applications, such as a configuration wherein water cooling is only applied to a single component such as a computer's CPU, the addition of the fan 19 increases the effectiveness of the heat-dissipating device 10 for applications where additional heat must be dissipated, such as a configuration wherein water cooling is applied to several system components.

Turning now to FIG. 3, a mounting technique is illustrated for fastening a water-block heat exchanger 20 to an electrical circuit component 52 on a circuit board 50, such as a computer system's motherboard. In the illustrated embodiment, the electrical circuit component 52 is a computer system's CPU, an integrated circuit package that is surface-mounted to the circuit board 50 in a conventional manner. The mounting technique is applicable to other circuit components as well.

The water-block heat exchanger 20 is placed on top of the electrical circuit component 52, with the bottom surface of the water-block heat exchanger 20 flush against the top surface of the electrical circuit component 52. A mounting bracket 25, which is generally a flat plate having an opening centrally defined therein to accommodate a water inlet 21 and outlet 23 that extend from the top of the water-block heat exchanger 20, is placed on top of the water-block heat exchanger 20 and bolted to the circuit board 50 to secure the water-block heat exchanger in place.

Adequate contact is desired between the bottom surface of the water-block heat exchanger 20 and the top surface of the electrical circuit component 52 to allow optimum heat transfer from the electrical circuit component 52 to the water-block heat exchanger 20. Thus, springs 27 are disposed on each bolt atop the mounting bracket 25, so that the effects of any temperature deformation of the circuit board 50, the electrical circuit component 52, the water-block heat exchanger 20, the mounting bracket 25, or the mounting hardware are minimized.

Turning now to FIGS. 4 and 5, an embodiment 100 of a water-block heat exchanger 20 for a computer system's CPU is shown. The CPU water-block 100 is formed from a single piece, solid block 110 of a metal such as aluminum or copper, or another material having a suitable heat-conducting property, the block 110 being generally square and having dimensions compatible with a computer CPU such as the Pentium© processor made by Intel©. A water channel 120 is formed within the block 110 by drilling a several interconnecting holes into the block 110. The block 110 is a square block having four sides 111, 111B, 111C and 111D, a top surface 113 and a bottom surface 115. Corners 117 of the block are beveled to assist in aligning the mounting bracket 25 with the block 110.

The water channel 120 comprises a first hole 121 drilled into a side 111A of the block 110, and extending substantially, but not completely, through the block 110. The first hole 121 lies adjacent and parallel to the bottom of the block 110, and follows a centerline 119 of the block 110. A second hole 122 is drilled into the side 111A of the block 110 beside and parallel to the first hole 121. A third hole 123 is drilled into the side 111B opposite the side 111A, the third hole 123 lying beside the first hole 121 and extending substantially, but not completely, through the block 110. A fourth hole 124 is drilled into a side 111C of the block 110, the fourth hole 124 lying near the side 111B of the block 110 and extending through the third hole 123 and joining the first hole 121. A fifth hole 125 is drilled into a side 111D of the block 110, the fifth hole 125 lying near the side 111A of the block 110 and extending through the second hole 122 and joining the first hole 121. The open ends of each of the holes 121, 122, 123, 124 and 125 are plugged to form a watertight passageway within the block 110. The result is an S shaped water channel 120 that can carry a fluid coolant through a significant portion of the CPU water-block 100 and, in particular, directs the fluid coolant through the center of the CPU water-block 100.

A water inlet 21 and a water outlet 23 are barbed fittings for receiving a flexible tubing to provide a fluid flow through the CPU water-block 100. The water inlet 21 and water outlet 23 are inserted into holes 127 and 129, respectively, drilled into the top surface 113 of the block 110 to join holes 122 and 123 within the block 110. Thus, water entering water inlet 21 flows through the water channel 110 and out through water outlet 23. The mounting bracket 25, shown in FIG. 6, is a flat rectangular plate having an opening 27 centrally defined therein to accommodate a water inlet 21 and outlet 23 that extend from the top of the CPU water-block 100.

Turning now to FIGS. 7 and 8, an embodiment 200 of a water-block heat exchanger 20 for a computer system's VGA chip is shown. The VGA water-block 200 is formed from a solid block 210 of a metal such as aluminum or copper, or another material having a suitable heat-conducting property, the block 210 being generally square and having dimensions compatible with a typical computer system VGA chip. A water channel 220 is formed within the VGA water-block 200 by drilling a several interconnecting holes into the block 210. The block 210 is a generally square block having four sides 211A, 211B, 211C and 211D, a top surface 213 and a bottom surface 215. Opposing corners of the block 210 are beveled to form opposing corner faces 217.

The water channel 220 comprises a first hole 221 drilled into one of the corner faces 217, and extending diagonally through the block 210, passing through the center of the block 210. The first hole 221 may extend entirely through the block, exiting the opposite corner face 217, or may end short of the opposite corner face 217. A second hole 222 is drilled into a side 111C of the block 210 alongside, and parallel to, side 111B of the block 210 to intersect with the first hole 221 near the corner face 217. A third hole 223 is drilled into side 111D of the block 210 alongside, and parallel to, side 111A of the block 210, to intersect with the first hole 221 near the corner face 217. The open ends of each of the holes 221, 222, and 223 are plugged to form a watertight Z shaped water channel 220 within the block 210.

A water inlet 21 and a water outlet 23 are barbed fittings for receiving a flexible tubing to provide a fluid flow through the VGA water-block 200. The water inlet 21 and water outlet 23 are inserted into holes 227 and 229, respectively, drilled into the top surface 213 of the block 210 to join holes 222 and 223 within the block 210. Thus, water entering water inlet 21 flows through the water channel 220 and out through water outlet 23. A mounting bracket 25, shown in FIG. 9, is a flat rectangular plate having an opening 27 centrally defined therein to accommodate a water inlet 21 and outlet 23 that extend from the top of the VGA water-block 200.

It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims. 

1. A water cooling system for computer components, comprising: a heat dissipating device comprising a tubing coil; at least one water-block heat exchanger adapted for removing heat from an electronic component; a coolant reservoir; a coolant pump disposed within said coolant reservoir; and a plurality of fluid conduits interconnecting said tubing coil, said at least one water-block heat exchanger, said coolant reservoir, and said coolant pump in fluid communication; wherein a coolant contained within said coolant reservoir is circulated through said at least one water-block heat exchanger and said heat dissipating device by said coolant pump.
 2. The water cooling system for computer components according to claim 1, wherein said tubing coil comprises a length of tubing coiled about an axis.
 3. The water cooling system for computer components according to claim 1, wherein said heat dissipating device further comprises a cooling fan, the cooling fan having a housing, an electric motor disposed within the housing, and at least one fan blade driven by the electric motor, the cooling fan being coupled to said tubing coil.
 4. The water cooling system for computer components according to claim 3, wherein said heat dissipating device further comprises a plurality of support posts extending from said housing, said tubing coil being supported by said support posts.
 5. The water cooling system for computer components according to claim 3, wherein said tubing coil comprises a length of tubing coiled about an axis.
 6. The water cooling system for computer components according to claim 5, wherein said cooling fan is oriented to blow air along said axis.
 7. A water cooling system for computer components, comprising: heat dissipating means for dissipating heat from a coolant; at least one water-block heat exchanger, the water block heat exchanger comprising a single piece block of material having a center point, the single piece block of material having a plurality of passages defined therein, the passages forming a water channel that passes through the center point; a coolant reservoir; a coolant pump disposed within said coolant reservoir; and a plurality of fluid conduits interconnecting said tubing coil, said at least one water-block heat exchanger, said coolant reservoir, and said coolant pump in fluid communication; wherein a coolant contained within said coolant reservoir is circulated through said at least one water-block heat exchanger and said heat dissipating device by said coolant pump.
 8. The water cooling system for computer components according to claim 7, wherein said water block heat exchanger further comprises a water inlet and a water outlet each in fluid communication with said water channel.
 9. The water cooling system for computer components according to claim 7, wherein said water channel is an S shaped channel.
 10. The water cooling system for computer components according to claim 7, wherein said water channel is a Z shaped channel.
 11. A water-block heat exchanger, comprising: a single piece block of material having a center point; and a plurality of passages defined within said block, the passages forming a water channel that passes through the center point; and a water inlet and a water outlet each disposed on said block in fluid communication with said water channel.
 12. The water-block heat exchanger according to claim 11, wherein said passages form an S shaped water channel.
 13. The water-block heat exchanger according to claim 11, wherein said passages form a Z shaped water channel. 